Intel xeon e5 1607

Specifications

Compare Intel® Products

Essentials

  • Product Collection IntelВ® XeonВ® Processor E5 Family
  • Code Name Products formerly Sandy Bridge EP
  • Vertical Segment Server
  • Processor Number E5-1607
  • Off Roadmap Yes
  • Status Launched
  • Launch Date Q1’12
  • Lithography 32 nm

Performance

  • # of Cores 4
  • # of Threads 4
  • Processor Base Frequency 3.00 GHz
  • Cache 10 MB
  • Bus Speed 0 GT/s
  • TDP 130 W
  • VID Voltage Range 0.60V — 1.35V

Supplemental Information

  • Embedded Options Available No
  • Datasheet View now

Memory Specifications

  • Max Memory Size (dependent on memory type) 375 GB
  • Memory Types DDR3 800/1066
  • Max # of Memory Channels 4
  • Max Memory Bandwidth 34.1 GB/s
  • ECC Memory Supported ‡ Yes

Expansion Options

  • PCI Express Revision 3.0
  • Max # of PCI Express Lanes 40

Package Specifications

  • Sockets Supported FCLGA2011
  • Max CPU Configuration 1
  • TCASE 64.0В°C
  • Package Size 52.5mm x 45.0 mm

Advanced Technologies

  • IntelВ® Turbo Boost Technology ‡ No
  • IntelВ® vProв„ў Platform Eligibility ‡ Yes
  • IntelВ® Hyper-Threading Technology ‡ No
  • IntelВ® Virtualization Technology (VT-x) ‡ Yes
  • IntelВ® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
  • IntelВ® VT-x with Extended Page Tables (EPT) ‡ Yes
  • IntelВ® 64 ‡ Yes
  • Instruction Set 64-bit
  • Instruction Set Extensions IntelВ® AVX
  • Idle States Yes
  • Enhanced Intel SpeedStepВ® Technology Yes
  • IntelВ® Demand Based Switching Yes
  • Thermal Monitoring Technologies Yes
  • IntelВ® Flex Memory Access Yes

Security & Reliability

  • IntelВ® AES New Instructions Yes
  • IntelВ® Trusted Execution Technology ‡ Yes
  • Execute Disable Bit ‡ Yes

Ordering and Compliance

Ordering and spec information

IntelВ® XeonВ® Processor E5-1607 (10M Cache, 3.00 GHz) FC-LGA10, Tray

  • MM# 919245
  • Spec Code SR0L8
  • Ordering Code CM8062107186102
  • Shipping Media TRAY
  • Stepping M1

Trade compliance information

  • ECCN 5A992C
  • CCATS G077159
  • US HTS 8542310001

PCN/MDDS Information

SR0L8

  • 919245 PCN | MDDS

Compatible Products

IntelВ® Server Board S1600JP Family

IntelВ® Server System R1000JP Family

IntelВ® C600 Series Chipsets

Downloads and Software

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. IntelВ® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

V >VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

IntelВ® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandw >Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology ‡

IntelВ® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility ‡

The Intel vProВ® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vProВ®

Intel® Hyper-Threading Technology ‡

IntelВ® Hyper-Threading Technology (IntelВ® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

IntelВ® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and ItaniumВ® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT) ‡

IntelВ® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in IntelВ® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64 ‡

IntelВ® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.В№ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

>Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStepВ® Technology

Enhanced Intel SpeedStepВ® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStepВ® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStepВ® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

IntelВ® Demand Based Switching

IntelВ® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStepВ® Technology in the server marketplace.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

IntelВ® Flex Memory Access

IntelВ® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

IntelВ® AES New Instructions

IntelВ® AES New Instructions (IntelВ® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

IntelВ® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to IntelВ® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.

More support options for IntelВ® XeonВ® Processor E5-1607 (10M Cache, 3.00 GHz, 0.0 GT/s IntelВ® QPI)

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Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with IntelВ® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

Processors that support 64-bit computing on IntelВ® architecture require an Intel 64 architecture-enabled BIOS.

Новый купон пользователя по заказам US $4.00

Гарантия возврата денег Возврат за 15 дней

  • Бренд: Intel
  • Модель Intel: E5-1607V2
  • Частота процессора: 3.0 ГГц
  • Применение: Сервер
  • Тип розетки: LGA2011
  • Состояние товара: Бывший в употреблении
  • Тип: Четырёхъядерный
  • Объем кэш памяти L2: 512 КБ
  • Поддержка 64-Разрядная: Да
  • Тип интерфейса: LGA2011
  • Количество ядер: Четыре ядра
  • Номер модели: E5-1607V2
  • Питание: 130 Вт
  • Техпроцесс: 22 нм
  • Упаковка: Нет
  • Рабочая частота: 3.0G
  • Объем кэш памяти L3: 10 МБ
  • Тип процессора: Intel Xeon

Советы:

Каждый товар был протестирован в критическом порядке перед отправкой, мы имеем

Постройте несколько тестовых станций специально для ЦП, пожалуйста, купите его без проблем.

Перед установкой ЦП:

1, удалите оригинальный процессор, Очистите пыль на вентиляторе и теплоотводе, очистите остаточный теплоотвод в оригинальной смазке, особенно жесткая смазка должна быть тщательно очищена, это очень важно!

2, в правильном направлении в новый процессор, и в верхней части процессора, покрытого тонким слоем смазки. Не ставьте слишком много, просто можете заполнить зазор между верхней частью металлического контакта процессора и теплоотвода. Самый идеальный (в пакетах, которые мы предоставили силикагель в качестве примера, выдавливать соответствующие 1/2 смазки)

3, положите его обратно в теплоотвод, первый палец нажимаются плавники двигаются вверх и вниз несколько раз, так что внутри смазки равномерно распределяется и выхлоп воздуха, затем в соответствии с цифровой последовательностью, маркируя винтовые плавники на (или диагонали) постепенно затягивается, Каждый круг вращения вкручивается под винт, а не ставится винт в конце, последовательное вращение до фиксированного баланса.

4, если процессор в машине после точки не яркий, можно использовать ластик, чтобы протереть металлическую контактную пластина процессора (иногда процессор пол пыль или пот может связаться), или к материнской плате (данные о разряжении биоса материнской платы). Память также может использоваться без ластика.

Примечание: Для процессора, например, обнаружение температуры процессора слишком высоко, или когда температура высокая и низкая нестабильность, процессор и память не яркие, пожалуйста, внимательно проверьте выше 4, чтобы проверить, подавляющее большинство проблем может быть решено.

Эти процессоры лишены сразу двух технологий: Turbo Boost и Hyper-Threading. Имеют небольшую, относительно старших моделей этой серии, частоту и всего 10 мб кэша. Помимо этого, работают с оперативной памятью только на частоте 800 или 1066 мгц, что довольно мало (все старшие модели поддерживают частоты вплоть до 1600 мгц, не говоря о разгоне) и обладают довольно внушительным tdp.

Характеристики

Модель Xeon E5 1603 Xeon E5 1607
Тех.процесс 32 nm 32 nm
Ядер 4 4
Потоков 4 4
Базовая частота 2.8 Ггц 3.0 Ггц
Максимальная частота в Turbo Boost
Множитель 28, заблокирован 30, заблокирован
Кэш 10 Мб 10 Мб
TDP 130 W 130 W
Макс. температура крышки процессора 64 C 64 C

Производительность

Довольно сильно проигрывают остальной линейке в производительности, особенно в многопотоке. Тем не менее, могут использоваться как временное решение, пока не найдутся средства на более мощный цп, или просто для систем, не требующих особой производительности. В остальных случаях, лучше взять хотя бы e5 1620 или недорогую модель из серии 2600.

Сравнительная производительность по версии cpuboss

Поиграть в не самые требовательные игры вполне реально, но от современных новинок не стоит ожидать высокого fps, сказывается малое количество потоков и другие ограничения моделей.




Где купить

Продаются модели на aliexpress, встречаются также на ebay. Приведем несколько ссылок на продавцов с али:


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